Экзамен по предмету. Английский язык. 2-й семестр.

Задание 1.Выберите правильную форму глагола.
1. No city has cables ___________ directly.
a. lay
b. are laying
c. laid
2. Computers ___________ to perform series of mathematical operations.
a. are used
b. are using
c. have used
3. ___________ power losses, thick wires should be used.
a. Reducing
b. To reduce
c. Having reduced
4. For information ___________, it must be attached to a radio – frequency carrier wave.
a. to be transmitted
b. will be transmitted
c. transmitted
5. Various installations ___________ to transform electric power into mechanical and heat power.
a. have been used
b. are using
c. are being used
и т.д.
Задание 2. Прочтите текст и выполните задания к тексту
MICROELECTROMECHANICAL SYSTEMS (MEMS)
1. Interest in creating MEMS grew in the 1980s, but it took nearly two decades to establish the design and manufacturing infrastructure needed for their commercial development. One of the first products with a large market was the automobile air-bag controller, which combines inertia sensors to detect a crash and electronic control circuitry to deploy the air bag in response. In the late 1990s a new type of electronic projector was marketed that employed millions of micromirrors, each with its own electronic tilt control, to convert digital signals into images that rival the best traditional television displays.

2. Emerging products include mirror arrays for optical switching in telecommunications, semiconductor chips with integrated mechanical oscillators for radio-frequency applications (such as cellular telephones), and a broad range of biochemical sensors for use in manufacturing, medicine, and security.
3. A technical issue in MEMS fabrication concerns the order in which to build the electronic and mechanical components. High-temperature annealing is needed to relieve stress and warping of the polycrystalline-silicon layers, but it can damage any electronic circuits that have already been added. On the other hand, building the mechanical components first requires protecting these parts while the electronic circuitry is fabricated. Various solutions have been used, including burying the mechanical parts in shallow trenches prior to the electronics fabrication and then uncovering them afterward.
4. Barriers to further commercial penetration of MEMS include their cost compared with the cost of simpler technologies, nonstandardization of design and modeling tools, and the need for more reliable packaging. A current research focus is on exploring properties at nanometre dimensions for devices known as nanoelectromechanical systems (NEMS). These devices, however, become increasingly sensitive to any defects arising from their fabrication.
(http://www.britannica.com)

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Дата оценки: 01.04.2013
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